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ISO122P Datasheet(PDF) 19 Page - Texas Instruments

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Part # ISO122P
Description  Precision Lowest Cost ISOLATION AMPLIFIER
PDF  20 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

ISO122P Datasheet(HTML) 19 Page - Texas Instruments

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MECHANICAL DATA
MPDS105 – AUGUST 2001
1
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
DVA (R-PDSO-G8/28)
PLASTIC SMALL-OUTLINE
4202103/B 08/01
Index
Area
114
15
28
Seating
Plane
17,70
18,10
7,60
7,40
10,01
10,65
2,35
2,65
0,30
0,10
0,51
0,33
0,32
0,23
0,25
0,75
x 45
°
1,27
0,40
0
°–8°
C
F
G
1,27
0,25 M
B
A
C
S
0,10
0,25
M
B
C
B
A
D
M
M
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C.
Body length dimension does not include mold
flash, protrusions, or gate burrs. Mold flash, protrusions,
and gate burrs shall not exceed 0,15 mm per side.
D.
Body width dimension does not include inter-lead flash
or portrusions. Inter-lead flash and protrusions
shall not exceed 0,25 mm per side.
E. The chamfer on the body is optional. If it is not present,
a visual index feature must be located within the
cross-hatched area.
F. Lead dimension is the length of terminal for soldering
to a substrate.
G. Lead width, as measured 0,36 mm or greater
above the seating plane, shall not exceed a
maximum value of 0,61 mm.
H.
Lead-to-lead coplanarity shall be less than
0,10 mm from seating plane.
I. Falls within JEDEC MS-013-AE with the exception
of the number of leads.



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