BAV70_SER_7

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 07 — 27 November 2007

9 of 15

NXP Semiconductors

BAV70 series

High-speed switching diodes

10. Packing information

[1]

For further information and the availability of packing methods, see Section 14.

[2]

T1: normal taping

[3]

T2: reverse taping

11. Soldering

Table 9.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]

Type number

Package

Description

Packing quantity

3000

10000

BAV70

SOT23

4 mm pitch, 8 mm tape and reel

-215

-235

BAV70M

SOT883

2 mm pitch, 8 mm tape and reel

-

-315

BAV70S

SOT363

4 mm pitch, 8 mm tape and reel; T1

[2] -115

-135

4 mm pitch, 8 mm tape and reel; T2

[3] -125

-165

BAV70T

SOT416

4 mm pitch, 8 mm tape and reel

-115

-135

BAV70W

SOT323

4 mm pitch, 8 mm tape and reel

-115

-135

Fig 12. Reflow soldering footprint BAV70 (SOT23/TO-236AB)

solder resist

occupied area

solder lands

solder paste

Dimensions in mm

sot023

1.00

0.60

(3x)

1.30

1

2

3

2.50

3.00

0.85

2.70

2.90

0.50 (3x)

0.60 (3x)

3.30

0.85