AD7873ACPZ datasheet(7/29 Pages) AD

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AD7873

Data Sheet

Rev. F | Page 6 of 28

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter

Rating

+VCC to GND

–0.3 V to +7 V

Analog Input Voltage to GND

–0.3 V to VCC + 0.3 V

Digital Input Voltage to GND

–0.3 V to VCC + 0.3 V

Digital Output Voltage to GND

–0.3 V to VCC + 0.3 V

VREF to GND

–0.3 V to VCC + 0.3 V

Input Current to Any Pin Except Supplies1

±10 mA

Operating Temperature Range

Commercial (A, B Versions)

–40°C to +85°C

Storage Temperature Range

–65°C to +150°C

Junction Temperature

150°C

Power Dissipation

450 mW

IR Reflow Soldering

Peak Temperature

220°C (±5°C)

Time-to-Peak Temperature

10 sec to 30 sec

Ramp-Down Rate

6°C/sec max

Pb-free Parts Only

Peak Temperature

250°C

Time-to-Peak Temperature

20 sec to 40 sec

Ramp-Up Rate

3°C/sec max

Ramp-Down Rate

6°C/sec max

Transient currents of up to 100 mA do not cause SCR latch-up.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

θJA

θJC

Unit

16-Lead QSOP

149.97

38.8

°C/W

16-Lead TSSOP

150.4

27.6

°C/W

16-Lead LFCSP

135.7

°C/W

ESD CAUTION

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