Copyright

© ANPEC Electronics Corp.

Rev. A.3 - Jun., 2013

www.anpec.com.tw

3

APW8722/A/B/C/D

Symbol

Parameter

Rating

Unit

VCC Supply Voltage (VCC to GND)

-0.3 ~ 16

V

BOOT Supply Voltage (BOOT to PHASE)

-0.3 ~ 16

V

BOOT Supply Voltage (BOOT to GND)

-0.3 ~ 32

V

> 20ns

V

UGATE Voltage (UGATE to PHASE)

< 20ns

V

> 20ns

V

LGATE Voltage (LGATE to GND)

< 20ns

V

> 20ns

-0.3 ~ 16

V

PHASE Voltage (PHASE to GND)

< 20ns

-5 ~ 25

V

FB ,COMP to GND

-0.3 ~ 7

V

POK to GND

V

Maximum Junction Temperature

150

°C

Storage Temperature

-65 ~ 150

°C

Maximum Lead Soldering Temperature, 10 Seconds

260

°C

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Thermal Resistance -Junction to Ambient

(Note 2)

SOP-8P

60

°C/W

Note 2:

θ

Symbol

Parameter

Range

Unit

VCC Supply Voltage (VCC to GND)

4.5 ~ 13.2

V

Converter Output Voltage for APW8722/A/D

0.6 ~ 5

V

Converter Output Voltage for APW8722B/C

0.8 ~ 5

V

Converter Input Voltage

3~13.2

V

Converter Output Current

0 ~ 25

A

Ambient Temperature

-40 ~ 85

°C

Junction Temperature

-40 ~ 125

°C

Note 3: Refer to the application circuit for further information.