LM48 datasheet(3/24 Pages) TI1

3 / 24 page

LM4808

www.ti.com

SNAS051D – FEBRUARY 2000 – REVISED MAY 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1) (2)

Supply Voltage

6.0V

Storage Temperature

−65°C to +150°C

Input Voltage

−0.3V to VDD + 0.3V

Power Dissipation (3)

Internally limited

ESD Susceptibility (4)

3500V

ESD Susceptibility (5)

250V

Junction Temperature

150°C

Vapor Phase (60 seconds)

215°C

Soldering Information (6)

Small Outline Package

Infrared (15 seconds)

220°C

θJC (VSSOP)

56°C/W

θJA (VSSOP)

210°C/W

θJC (SOIC)

35°C/W

Thermal Resistance

θJA (SOIC)

170°C/W

θJC (WSON)

15°C/W

θJA (WSON)

117°C/W (7)

θJA (WSON)

150°C/W (8)

(1)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical

specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the

Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication

of device performance.

(3)

The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature

TA. The maximum allowable power dissipation is P DMAX = (TJMAX − TA) / θJA. For the LM4808, TJMAX = 150°C, and the typical junction-

to-ambient thermal resistance, when board mounted, is 210°C/W for package DGK0008A and 170°C/W for package D0008A.

(4)

Human body model, 100 pF discharged through a 1.5 k

Ω resistor.

(5)

Machine Model, 220 pF–240 pF discharged through all pins.

(6)

See http://www.ti.com for other methods of soldering surface mount devices.

(7)

The given

θJA is for an LM4808 packaged in an NGL0008B with the Exposed-DAP soldered to a printed circuit board copper pad with an

area equivalent to that of the Exposed-DAP itself.

(8)

The given

θJA is for an LM4808 packaged in an NGL0008B with the Exposed-DAP not soldered to any printed circuit board copper.

OPERATING RATINGS

Temperature Range

TMIN ≤ TA ≤ TMAX

−40°C ≤ T A ≤ 85°C

Supply Voltage

2.0V

≤ VDD ≤ 5.5V

ELECTRICAL CHARACTERISTICS

(1) (2)

The following specifications apply for VDD = 5V unless otherwise specified, limits apply to TA = 25°C.

Symbol

Parameter

Conditions

LM4808

Units

(Limits)

Typ (3)

Limit (4)

2.0

V (min)

VDD

Supply Voltage

5.5

V (max)

IDD

Supply Current

VIN = 0V, IO = 0A

1.2

3.0

mA (max)

(1)

All voltages are measured with respect to the ground pin, unless otherwise specified.

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical

specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the

Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication

of device performance.

(3)

Typicals are measured at 25°C and represent the parametric norm.

(4)

Tested limits are specified to AOQL (Average Outgoing Quality Level). Datasheet min/max specification limits are specified by design,

test, or statistical analysis.

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