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XC6504 Datasheet(PDF) 28 Page - Torex Semiconductor |
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XC6504 Datasheet(HTML) 28 Page - Torex Semiconductor |
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28 / 32 page ![]() 28/32 XC6504 Series ■ PACKAGING INFORMATION (Continued) ● SOT-25 Power Dissipation Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. 評価基板レイアウト(単位:mm) Evaluation Board (Unit: mm) Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm 2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used.) Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter 2. Power Dissipation vs. Ambient temperature Board Mount (Tj max = 125℃) Ambient Temperature(℃) Power Dissipation Pd(mW) Thermal Resistance (℃/W) 25 600 85 240 166.67 Pd-Ta特性グラフ 0 100 200 300 400 500 600 700 25 45 65 85 105 125 周辺温度Ta(℃) Pd vs. Ta Ambient Temperature: Ta (℃) |
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