ISO7131CC, ISO7140CC, ISO7140FCC

ISO7141CC, ISO7141FCC

www.ti.com

SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013

ABSOLUTE MAXIMUM RATINGS

(1)

PARAMETER

VALUE

–0.5 V to 6 V

Input voltage

INx, ENx

–0.5 V to 6 V

Output voltage

OUTx

Output current

±15 mA

Human-body model

ESDA / JEDEC JS-001-2012

±4 kV

Electrostatic discharge

All pins

Field-induced charged device

JEDEC JESD22-C101E

±1.5 kV

model

Maximum junction

150°C

temperature

Storage temperature

–65°C to 150°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak

voltage values.

RECOMMENDED OPERATING CONDITIONS

PARAMETER

MIN

TYP

MAX

UNIT

Supply voltage

2.7

5.5

V

–4

mA

–2

mA

Low-level output current

4

mA

High-level input voltage

2

V

Low-level input voltage

0

0.8

V

20

ns

25

ns

0

50

Mbps

0

40

Mbps

Junction temperature

–40

136

°C

Ambient temperature

–40

25

125

°C

THERMAL INFORMATION

ISO7131, ISO714x

UNIT

DBQ (16 Pins)

Junction-to-ambient thermal resistance

104.5

°C/W

Junction-to-case(top) thermal resistance

57.8

°C/W

Junction-to-board thermal resistance

46.8

°C/W

Junction-to-top characterization parameter

18.3

°C/W

Junction-to-board characterization parameter

46.4

°C/W

Junction-to-case(bottom) thermal resistance

n/a

°C/W

Device power dissipation

150

mW

Input a 25-MHz, 50% duty cycle square wave

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Copyright © 2013, Texas Instruments Incorporated

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