MP2670 – CHARGE SYSTEM PROTECTION CIRCUIT

MP2670 Rev. 0.91

www.MonolithicPower.com

2

5/13/2010

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© 2010 MPS. All Rights Reserved.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Temperature

MP2670DQ

QFN10

(3mm x 3mm)

X7

–40

°C to +85°C

* For Tape & Reel, add suffix –Z (g. MP2670DQ–Z).For RoHS compliant packaging, add suffix –LF (e.g.

MP2670DQ–LF–Z)

PACKAGE REFERENCE

TOP VIEW

VIN

GND

FLT

NC

NC

1

2

3

4

5

OUT

OUT

ILIM

VB

EN

10

9

8

7

6

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

OUT and VB to GND........................–0.3V to 7V

Junction Temperature...............................150

°C

Lead Temperature (Solder).......................260

°C

Storage Temperature.............. –65

°C to +150°C

Recommended Operating Conditions

(2)

Operating Temperature............. –40

°C to +85°C

Thermal Resistance

(3)

QFN10 (3mm x 3mm) .............50 ...... 12 ...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The device is not guaranteed to function outside of its

operating conditions.

3) Measured on JESD51-7, 4-layer PCB.