page 9 of 11

7. Technical Drawing

This drawing and its inherent design concepts are property of Taoglas. Not to

be copied or given to third parties without the written consent of Taoglas.

TW Design Centre

ALL Initial Design

Kiwi

2011/9/29

A

1.Soldered Area

2.Solder Mask Area(Green)

3.Clearance Area

4.Shielding Case Area

5.Area to be solder (Pad)

Note:

Name

Material

Finish

QTY

Patch (10mmx10mmx4.2mm)

Ceramic

Clear

1

1

Shielding Case

Tin (SPTE)

Tin Plated

1

2

PCB

FR4 0.6t

Green

1

3

Top View

Bottom View

Side View

PCB Footprint

Front

Back

Application Assembly

Ground

Side

PCB Thickness 0.8mm

B

F5

Add logo+P/N on the patch

Kiwi

2011/11/9

B

P/N

AP.10G

C

G3

Amend drawing content

Sandy

2011/11/16

Name

Material

Finish

QTY

1 Patch (10mm x 10mm x 4.2mm) Ceramic

Clear

1

2 Shielding Case

Tin (SPTE)

Tin Plated

1

3 PCB

FR4 0.6t

Green

1

This drawing and its inherent design concepts are property of Taoglas. Not to

be copied or given to third parties without the written consent of Taoglas.

TW Design Centre

ALL Initial Design

Kiwi

2011/9/29

A

1.Soldered Area

2.Solder Mask Area(Green)

3.Clearance Area

4.Shielding Case Area

5.Area to be solder (Pad)

Note:

Name

Material

Finish

QTY

Patch (10mmx10mmx4.2mm)

Ceramic

Clear

1

1

Shielding Case

Tin (SPTE)

Tin Plated

1

2

PCB

FR4 0.6t

Green

1

3

Top View

Bottom View

Side View

PCB Footprint

Front

Back

Application Assembly

Ground

Side

PCB Thickness 0.8mm

B

F5

Add logo+P/N on the patch

Kiwi

2011/11/9

B

P/N

AP.10G

C

G3

Amend drawing content

Sandy

2011/11/16

NOTE:

1. Soldered area

2. Solder Mask Area (Green)

3. Clearance Area

4. Shielding Case Area

5. Area to be solder (Pad)