LM2586 datasheet(2/38 Pages) TI

2 / 38 page

LM2586

SNVS121D – MAY 1996 – REVISED APRIL 2013

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Connection Diagrams

Figure 1. Bent, Staggered Leads

Figure 2. Bent, Staggered Leads

7-Lead TO-220 (NDZ)

Top View

Side View

See Package Number NDZ0007B

Figure 3. 7-Lead DDPAK (KTW)

Figure 4. 7-Lead DDPAK (KTW)

Top View

Side View

See Package Number KTW0007B

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Input Voltage

−0.4V ≤ VIN ≤ 45V

Switch Voltage

−0.4V ≤ VSW ≤ 65V

Switch Current (3)

Internally Limited

Compensation Pin Voltage

−0.4V ≤ VCOMP ≤ 2.4V

Feedback Pin Voltage

−0.4V ≤ VFB ≤ 2 VOUT

ON /OFF Pin Voltage

−0.4V ≤ VSH ≤ 6V

Sync Pin Voltage

−0.4V ≤ VSYNC ≤ 2V

Power Dissipation (4)

Internally Limited

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 10 sec.)

260°C

Maximum Junction Temperature (4)

150°C

Minimum ESD Rating

(C = 100 pF, R = 1.5 k

Ω)

2 kV

(1)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. These ratings apply when the current is

limited to less than 1.2 mA for pins 1, 2, 3, and 6. Operating ratings indicate conditions for which the device is intended to be functional,

but device parameter specifications may not be ensured under these conditions. For ensured specifications and test conditions, see the

Electrical Characteristics.

(3)

Note that switch current and output current are not identical in a step-up regulator. Output current cannot be internally limited when the

LM2586 is used as a step-up regulator. To prevent damage to the switch, the output current must be externally limited to 3A. However,

output current is internally limited when the LM2586 is used as a flyback regulator (see the Application Hints section for more

information).

(4)

The junction temperature of the device (TJ) is a function of the ambient temperature (TA), the junction-to-ambient thermal resistance

(

θJA), and the power dissipation of the device (PD). A thermal shutdown will occur if the temperature exceeds the maximum junction

temperature of the device: PD × θJA + TA(MAX) ≥ TJ(MAX). For a safe thermal design, check that the maximum power dissipated by the

device is less than: PD ≤ [TJ(MAX) − TA(MAX)]/θJA. When calculating the maximum allowable power dissipation, derate the maximum

junction temperature—this ensures a margin of safety in the thermal design.

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