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LM2586 Datasheet(PDF) 29 Page - Texas Instruments |
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LM2586 Datasheet(HTML) 29 Page - Texas Instruments |
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29 / 38 page ![]() LM2586 www.ti.com SNVS121D – MAY 1996 – REVISED APRIL 2013 Figure 59. Circuit Board Layout CIRCUIT LAYOUT GUIDELINES As in any switching regulator, layout is very important. Rapidly switching currents associated with wiring inductance generate voltage transients which can cause problems. For minimal inductance and ground loops, keep the length of the leads and traces as short as possible. Use single point grounding or ground plane construction for best results. Separate the signal grounds from the power grounds (as indicated in Figure 59). When using the Adjustable version, physically locate the programming resistors as near the regulator IC as possible, to keep the sensitive feedback wiring short. HEAT SINK/THERMAL CONSIDERATIONS In many cases, a heat sink is not required to keep the LM2586 junction temperature within the allowed operating temperature range. For each application, to determine whether or not a heat sink will be required, the following must be identified: 1) Maximum ambient temperature (in the application). 2) Maximum regulator power dissipation (in the application). 3) Maximum allowed junction temperature (125°C for the LM2586). For a safe, conservative design, a temperature approximately 15°C cooler than the maximum junction temperature should be selected (110°C). 4) LM2586 package thermal resistances θJA and θJC (given in the Electrical Characteristics). Total power dissipated (PD) by the LM2586 can be estimated as follows: where • VIN is the minimum input voltage • VOUT is the output voltage • N is the transformer turns ratio, D is the duty cycle • ILOAD is the maximum load current (and ∑ILOAD is the sum of the maximum load currents for multiple-output flyback regulators) (7) The duty cycle is given by: Copyright © 1996–2013, Texas Instruments Incorporated Submit Documentation Feedback 29 Product Folder Links: LM2586 |
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