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SC16IS752 Datasheet(PDF) 3 Page - NXP Semiconductors |
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SC16IS752 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 60 page ![]() SC16IS752_SC16IS762 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 9 — 22 March 2012 3 of 60 NXP Semiconductors SC16IS752; SC16IS762 Dual UART with I2C-bus/SPI interface, 64-byte FIFOs, IrDA SIR 4. Ordering information Table 1. Ordering information Type number Package Name Description Version SC16IS752IPW TSSOP28 plastic thin shrink small outline package; 28 leads; body width 4.4 mm SOT361-1 SC16IS762IPW SC16IS752IBS HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 5 0.85 mm SOT617-1 SC16IS762IBS |
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