AVM1504D

Rev 1.2

2002/11/6

8

BONDING DIAGRAM:

AVM1504D

Pad No.

Name

X

Y

1

Vdd

-751.0

-686.75

2

OSC

-516.9

-695.55

3

TEST

-309.9

-695.55

4

TG1

-102.9

-695.55

5

AUDIO

324.5

-695.55

6

STS1

531.5

-695.55

7

GND

758.9

-686.75

Substrate must be connected to GND.

Chip Size: 1070um x 1060um

Pad Size: 80um x 80um

NOTE: All data and specifications are subject to change without notice.

1

2

3

4

5

6

7

APPLICATION CIRCUIT:

A> SEQUENTIAL, LED DRIVING.

B> SNOOZE FUNCTION, POWER-ON TYPE

NOTE : Rosc=300K ohm , T=ß 100 TRANSISTOR , R1=1K NEED ( ONLY WHEN WISH TO LOWER THE POWER CONSUMPTION).

SPK=8 ohm SPEAKER ( ALL ARE TYPICAL ).

VDD

GND

LED

Rosc

OSC

R1

SPK

T

STS1

AUDIO

TG1

A1

VDD

GND

LED

Rosc

OSC

R1

SPK

T

STS1

AUDIO

TG1

S2

●

S1

(timer switch)

(normal on switch)

APPLICATION CIRCUIT:

A> SEQUENTIAL, LED DRIVING.

B> SNOOZE FUNCTION, POWER-ON TYPE

NOTE : Rosc=300K ohm , T=ß 100 TRANSISTOR , R1=1K NEED ( ONLY WHEN WISH TO LOWER THE POWER CONSUMPTION).

SPK=8 ohm SPEAKER ( ALL ARE TYPICAL ).

VDD

GND

LED

Rosc

OSC

R1

SPK

T

STS1

AUDIO

TG1

A1

VDD

GND

LED

Rosc

OSC

R1

SPK

T

STS1

AUDIO

TG1

S2

●

S1

(timer switch)

(normal on switch)