AS8222

Datasheet - Absolute Maximum Rat i ngs

www.ams.com/eng/FlexRay/AS8222

Revision 1.0

7 - 42

Damage Tests

Wake pins (damage tests)

-100

V

ISO7637-2 test pulse 1; class D

(see Figure 14)

+75

V

ISO7637-2 test pulses 2a; class D

(see Figure 14)

-150

V

ISO7637-2 test pulses 3a; class D

(see Figure 14)

+100

V

ISO7637-2 test pulses 3b; class D

(see Figure 14)

Power Dissipation

Total power dissipation (all supplies

and outputs)

150

mW

Temperature Ranges and Storage Conditions

Storage temperature

-55

+150

ºC

Package body temperature

1

260

ºC

H

Humidity non-condensing

5

85

%

MSL

Moisture Sensitivity Level

2

3

1. The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD-020 “Moisture/Reflow

Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. The lead finish for Pb-free leaded packages is matte tin

(100% Sn).

2. Represents a maximum floor life time of 168h.

Table 2. Absolute Maximum Ratings

Symbol

Parameter

Min

Max

Units

Note