MAX3372EEKAT datasheet(13/26 Pages) MAXIM

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MAX3372E–MAX3379E/MAX3390E–MAX3393E

±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad

Low-Voltage Level Translators in UCSP

Maxim Integrated

CHARGE-CURRENT-

LIMIT RESISTOR

DISCHARGE

RESISTANCE

STORAGE

CAPACITOR

100pF

RC 1M

RD 1500

HIGH-

VOLTAGE

SOURCE

DEVICE-

UNDER-

TEST

Figure 3a. Human Body ESD Test Model

IP 100%

90%

36.8%

tRL

TIME

tDL

CURRENT WAVEFORM

PEAK-TO-PEAK RINGING

(NOT DRAWN TO SCALE)

10%

AMPERES

Figure 3b. Human Body Current Waveform

±15kV ESD Protection

As with all Maxim devices, ESD-protection structures are

incorporated on all pins to protect against electrostatic

discharges encountered during handling and assembly.

The I/O VCC lines have extra protection against static

electricity. Maxim’s engineers have developed state-of-

the-art structures to protect these pins against ESD of

±15kV without damage. The ESD structures withstand

high ESD in all states: normal operation, three-state

output mode, and powered down. After an ESD event,

Maxim’s E versions keep working without latchup,

whereas competing products can latch and must be

powered down to remove latchup.

ESD protection can be tested in various ways. The I/O

VCC lines of this product family are characterized for

protection to the following limits:

1) ±15kV using the Human Body Model

2) ±8kV using the Contact Discharge method specified

in IEC 1000-4-2

3) ±10kV using IEC 1000-4-2’s Air-Gap Discharge

method

ESD Test Conditions

ESD performance depends on a variety of conditions.

Contact Maxim for a reliability report that documents

test setup, test methodology, and test results.

Human Body Model

Figure 3a shows the Human Body Model and Figure 3b

shows the current waveform it generates when dis-

charged into a low impedance. This model consists of

a 100pF capacitor charged to the ESD voltage of inter-

est, which is then discharged into the test device

through a 1.5k

Ω resistor.

IEC 1000-4-2

The IEC 1000-4-2 standard covers ESD testing and

performance of finished equipment; it does not specifi-

cally refer to integrated circuits. The MAX3372E–

MAX3379E and MAX3390E–MAX3393E help to design

equipment that meets Level 3 of IEC 1000-4-2, without

the need for additional ESD-protection components.

The major difference between tests done using the

Human Body Model and IEC 1000-4-2 is higher peak

current in IEC 1000-4-2, because series resistance is

lower in the IEC 1000-4-2 model. Hence, the ESD with-

stand voltage measured to IEC 1000-4-2 is generally

lower than that measured using the Human Body Model.

Figure 4a shows the IEC 1000-4-2 model, and Figure 4b

shows the current waveform for the ±8kV, IEC 1000-4-2,

Level 4, ESD contact-discharge test.

The air-gap test involves approaching the device with a

charged probe. The contact-discharge method con-

nects the probe to the device before the probe

is energized.

Machine Model

The Machine Model for ESD tests all pins using a

200pF storage capacitor and zero discharge resis-

tance. Its objective is to emulate the stress caused by

contact that occurs with handling and assembly during

manufacturing. Of course, all pins require this protec-

tion during manufacturing, not just inputs and outputs.

Therefore, after PCB assembly, the Machine Model is

less relevant to I/O ports.

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