MAX3372EEKAT datasheet(2/26 Pages) MAXIM

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MAX3372E–MAX3379E/MAX3390E–MAX3393E

±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad

Low-Voltage Level Translators in UCSP

Maxim Integrated

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VCC = +1.65V to +5.5V, VL = +1.2V to (VCC + 0.3V), GND = 0, I/O VL_ and I/O VCC_ unconnected, TA = TMIN to TMAX, unless other-

wise noted. Typical values are at VCC = +3.3V, VL = +1.8V, TA = +25°C.) (Notes 1, 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

(All voltages referenced to GND.)

VCC ...........................................................................-0.3V to +6V

I/O VCC_......................................................-0.3V to (VCC + 0.3V)

I/O VL_ ...........................................................-0.3V to (VL + 0.3V)

THREE-STATE...............................................-0.3V to (VL + 0.3V)

Short-Circuit Duration I/O VL, I/O VCC to GND...........Continuous

Short-Circuit Duration I/O VL or I/O VCC to GND

Driven from 40mA Source

(except MAX3372E and MAX3377E) .....................Continuous

Continuous Power Dissipation (TA = +70°C)

8-Pin SOT23 (derate 5.6mW/°C above +70°C)........444.4mW

8-Pin TDFN (derate 18.5mW/°C above +70°C) ........1482mW

3 x 3 UCSP (derate 4.7mW/°C above +70°C) ............379mW

3 x 4 UCSP (derate 6.5mW/°C above +70°C) ............520mW

14-Pin TSSOP (derate 9.1mW/°C above +70°C) ........727mW

14-Pin TDFN (derate 18.5mW/°C above +70°C) ......1482mW

Operating Temperature Range ...........................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLIES

VL Supply Range

1.2

5.5

VCC Supply Range

VCC

1.65

5.50

Supply Current from VCC

IQVCC

130

300

µA

Supply Current from VL

IQVL

100

µA

VCC Three-State Output Mode

Supply Current

ITHREE-STATE-VCC

TA = +25

°C, THREE-STATE = GND

0.03

µA

VL Three-State Output Mode

Supply Current

ITHREE-STATE-VL

TA = +25

°C, THREE-STATE = GND

0.03

µA

Three-State Output Mode

Leakage Current

I/O VL_ and I/O VCC_

ITHREE-STATE-LKG

TA = +25

°C, THREE-STATE = GND

0.02

µA

THREE-STATE Pin Input LeakageTA = +25

°C

0.02

µA

ESD PROTECTION

IEC 1000-4-2 Air-Gap Discharge

±8

IEC 1000-4-2 Contact Discharge

±8

I/O VCC (Note 3)

Human Body Model

±15

LOGIC-LEVEL THRESHOLDS (MAX3372E/MAX3377E)

I/O VL_ Input-Voltage High

VIHL

VL - 0.2

I/O VL_ Input-Voltage Low

VILL

0.15

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