ABSOLUTE MAXIMUM RATINGS

PACKAGE DISSIPATION RATINGS

SN10501

SN10502

SN10503

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

operating free-air temperature range unless otherwise

(1)

UNIT

16.5 V

150 mA

4 V

Continuous power dissipation See Dissipation Rating Table

150°C

(2)

125°C

–65°C to 150°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300°C

(1)

The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may

cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are

stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

(2)

The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may

result in reduced reliability and/or lifetime of the device.

PACKAGE

θ

(1)

θ

DBV (5)

55

255.4

391 mW

156 mW

D (8)

38.3

97.5

1.02 W

410 mW

D (14)

26.9

66.6

1.5 W

600 mW

DGK (8)

54.2

260

385 mW

154 mW

4.7

58.4

1.71 W

685 mW

2.07

37.5

2.67 W

1.07 W

(1)

This data was taken using the JEDEC standard High-K test PCB.

(2)

Power rating is determined with a junction temperature of 125°C. This is the point where distortion

starts to substantially increase. Thermal management of the final PCB should strive to keep the

junction temperature at or below 125°C for best performance and long term reliability.

(3)

The SN10501, SN10502, and SN10503 may incorporate a PowerPAD™ on the underside of the chip.

This acts as a heatsink and must be connected to a thermally dissipating plane for proper power

dissipation. Failure to do so may result in exceeding the maximum junction temperature which could

permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing

the PowerPAD™ thermally enhanced package.

2

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