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ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS TABLE PER PACKAGE

THS4520

SLOS503B – SEPTEMBER 2006 – REVISED JULY 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

over operating free-air temperature range (unless otherwise noted)

UNIT

Supply voltage

6 V

Input voltage

±V

S

Differential input voltage

4 V

200 mA

Continuous power dissipation

See Dissipation Rating Table

Maximum junction temperature

150

°C

Maximum junction temperature, continuous operation, long term reliability

125

°C

Operating free-air temperature range

–40

°C to 85°C

Storage temperature range

–65

°C to 150°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

°C

HBM

2000

ESD ratings

CDM

1500

MM

100

(1)

The THS4520 incorporates a (QFN) exposed thermal pad on the underside of the chip. See TI technical brief SLMA002 and SLMA004

for more information about utilizing the QFN thermally enhanced package.

POWER RATING

RGT (16)

2.4

°C/W

39.5

°C/W

2.3 W

225 mW

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

2

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