THS4509

SLOS454H – JANUARY 2005 – REVISED NOVEMBER 2009

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGED DEVICES

TEMPERATURE

SYMBOL

(RGT-16)

THS4509RGTT

–40°C to +85°C

—

THS4509RGTR

(1)

For the most current package and ordering information see the Package Option Addendum at the end

of this document, or see the TI web site at www.ti.com.

(2)

This package is available taped and reeled. The R suffix standard quantity is 3000. The T suffix

standard quantity is 250.

(3)

The exposed thermal pad is electrically isolated from all other pins.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

UNIT

Supply voltage

6 V

Input voltage

Differential input voltage

4 V

200 mA

Continuous power dissipation

See Dissipation Rating Table

Maximum junction temperature

+150°C

Operating free-air temperature range

–40°C to +85°C

Storage temperature range

–65°C to +150°C

HBM

2000 V

ESD ratings

CDM

1500 V

MM

100 V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

The THS4509 incorporates a (QFN) exposed thermal pad on the underside of the chip. This pad acts as a heatsink and must be

connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction

temperature which could permanently damage the device. See TI technical briefs SLMA002 and SLMA004 for more information about

using the QFN thermally-enhanced package.

DISSIPATION RATINGS TABLE

POWER RATING

PACKAGE

RGT (16)

2.4°C/W

39.5°C/W

2.3 W

225 mW

2

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