LM2736

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SNVS316E – SEPTEMBER 2004 – REVISED SEPTEMBER 2011

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1)

-0.5V to 22V

SW Voltage

-0.5V to 22V

Boost Voltage

-0.5V to 28V

Boost to SW Voltage

-0.5V to 6.0V

FB Voltage

-0.5V to 3.0V

EN Voltage

Junction Temperature

150°C

2kV

Storage Temp. Range

-65°C to 150°C

Soldering Information

Infrared/Convection Reflow (15sec)

220°C

Wave Soldering Lead Temp. (10sec)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test

conditions, see Electrical Characteristics.

(2)

Human body model, 1.5k

Ω in series with 100pF.

Operating Ratings

(1)

3V to 18V

SW Voltage

-0.5V to 18V

Boost Voltage

-0.5V to 23V

Boost to SW Voltage

1.6V to 5.5V

Junction Temperature Range

−40°C to +125°C

Thermal Resistance

(2)

118°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test

conditions, see Electrical Characteristics.

(2)

packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air. For a 2 layer board using 1 oz. copper in still

air,

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