Preliminary Data Sheet P13775EJ2V0DS00

8

NE960R2 SERIES

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions.

For soldering methods and

conditions other than those recommended below, contact your NEC sales representative.

Soldering Method

Soldering Conditions

Recommended Condition Symbol

Partial Heating

Pin temperature: 260

°C

Time: 5 seconds or less (per pin row)

Exposure limit: None

Note

–

Note After opening the dry pack, keep it in a place below 25

°C and 65 % RH for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

CHIP HANDLING

DIE ATTACHMENT

Die attach can be accomplished with a Au-Sn (300

±10°C) performs in a forming gas environment. Epoxy die

attach is not recommended.

BONDING

Gate and drain bonding wires should be minimum length, semi-hard gold wire (3 to 8 % elongation) 30 microns or

less in diameter.

Bonding should be performed with a wedge tip that has a taper of approximately 15 %.

Die attach and bonding time should be kept to a minimum. As a general rule, the bonding operation should be

kept within a 280

°C_5 minute curve. If longer periods are required, the temperature should be lowered.

PRECAUTIONS

The user must operate in a clean, dry environment.

The chip channel is glassivated for mechanical protection only and does not preclude the necessity of a clean

environment.

The bonding equipment should be periodically checked for sources of surge voltage and should be properly

grounded at all times. In fact, all test and handling equipment should be grounded to minimize the possibilities of

static discharge.