4N45 datasheet(3/7 Pages) HP

3 / 7 page

Regulatory Information

The 4N45 and 4N46 have been

approved by the following

regulatory organizations:

Recognized under UL 1577,

Component Recognition

Program, File E55361.

CSA

Approved under CSA Component

Acceptance Notice #5, File CA

88324.

240

∆T = 115°C, 0.3°C/SEC

∆T = 100°C, 1.5°C/SEC

∆T = 145°C, 1°C/SEC

TIME – MINUTES

220

200

180

160

140

120

100

260

456789

Thermal Profile (Option #300)

Figure 1. Maximum Solder Reflow Thermal Profile.

(Note: Use of non-chlorine activated fluxes is recommended.)

Insulation and Safety Related Specifications

Parameter

Symbol

Value

Units

Conditions

Min. External Air Gap

L(IO1)

7.1

Measured from input terminals to output

(External Clearance)

terminals, shortest distance through air

Min. External Tracking Path

L(IO2)

7.4

Measured from input terminals to output

(External Creepage)

terminals, shortest distance path along body

Min. Internal Plastic Gap

0.08

Through insulation distance, conductor to

(Internal Clearance)

conductor, usually the direct distance

between the photoemitter and photodetector

inside the optocoupler cavity

Tracking Resistance

CTI

200

Volts

DIN IEC 112/VDE 0303 PART 1

(Comparative Tracking Index)

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

Option 300 – surface mount classification is Class A in accordance with CECC 00802.

Absolute Maximum Ratings

Storage Temperature, TS ............................................. -55°C to +125°C

Operating Temperature, TA ........................................... -40°C to +85°C

Lead Solder Temperature, max .......................................... 260

°C for 10 s

(1.6 mm below seating plane)

Average Input Current, IF ......................................................... 20 mA[1]

Peak Input Current, IF ................................................................... 40 mA

(50% duty cycle, 1 ms pulse width)

Peak Transient Input Current, IF ...................................................... 1.0 A

(

≤ 1 µs pulse width, 300 pps)

Reverse Input Voltage, VR ................................................................. 5 V

Input Power Dissipation, PI .................................................... 35 mW[2]

Output Current, IO (Pin 5) ...................................................... 60 mA[3]

Emitter-Base Reverse Voltage (Pins 4-6) .......................................... 0.5 V

Output Voltage, VO (Pin 5-4)

4N45 ................................................................................. -0.5 to 7 V

4N46 ............................................................................... -0.5 to 20 V

Output Power Dissipation ..................................................... 100 mW[4]

Infrared and Vapor Phase Reflow Temperature

(Option #300) .......................................... see Fig. 1, Thermal Profile

1-436

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