ADG466/ADG467

–3–

REV. 0

ABSOLUTE MAXIMUM RATINGS

1

2

2

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –35 V to +35 V

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA

Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA

(Pulsed at 1 ms, 10% Duty Cycle Max)

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . . –65

°C to +125°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Plastic DIP Package

θ

. . . . . . . . . . . . . . . . . . . . 125

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260

°C

SOIC Package

θ

. . . . . . . . . . . . . . . . . . . . 160

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

µSOIC Package

θ

. . . . . . . . . . . . . . . . . . . . 160

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

SSOP Package

θ

. . . . . . . . . . . . . . . . . . . . 130

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

NOTES

permanent damage to the device. This is a stress rating only and functional

operation of the device at these or any other conditions above those listed in the

operational sections of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Only one absolute maximum rating may be applied at any one time.

Information” section of the data sheet.

WARNING!

ESD SENSITIVE DEVICE

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the ADG466/ADG467 features proprietary ESD protection circuitry, permanent

damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper

ESD precautions are recommended to avoid performance degradation or loss of functionality.

PIN CONFIGURATIONS

8-Lead

DIP, SOIC

18-Lead

and

SOIC

SOIC

1

2

3

4

8

7

6

5

TOP VIEW

(Not to Scale)

ADG466

14

13

12

11

17

16

15

18

10

9

8

1

2

3

4

7

6

5

TOP VIEW

(Not to Scale)

ADG467

20-Lead

SSOP

14

13

12

11

17

16

15

20

19

18

10

9

8

1

2

3

4

7

6

5

TOP VIEW

(Not to Scale)

ADG467

NC = NO CONNECT

NC

NC

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADG466BN

–40

°C to +85°C

8-Lead Plastic DIP

N-8

ADG466BR

–40

°C to +85°C

8-Lead Small Outline Package

SO-8

ADG466BRM

–40

°C to +85°C

8-Lead Micro Small Outline Package

RM-8

ADG467BR

–40

°C to +85°C

18-Lead Small Outline Package

R-18

ADG467BRS

–40

°C to +85°C

20-Lead Shrink Small Outline Package

RS-20

OBSOLETE