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GS3490 Datasheet(PDF) 20 Page - Semtech Corporation |
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GS3490 Datasheet(HTML) 20 Page - Semtech Corporation |
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20 / 22 page ![]() GS3490 Final Data Sheet Rev. 1 GENDOC-058568 April 2014 20 of 22 Proprietary & Confidential www.semtech.com 6.2 Packaging Data 6.3 Recommended PCB Footprint Figure 6-2: Recommended PCB Footprint Parameter Value Package Type 32-pin QFN / 5mm x 5mm / 0.5mm pad pitch Moisture Sensitivity Level 3 Junction to Case Thermal Resistance, θ j-c 17.8°C/W Junction to Air Thermal Resistance, θ j-a (at zero airflow) 26.4°C/W Psi ( ψ) =Junction-to-Top (of Package) Characterization Parameter 0.4°C/W Pb-free and RoHS compliant Yes 0.6 0.3 0.50 4.20 3.30 0.40 x 45° Notes: 1. All dimensions in mm. 2. Drawing not to scale. 3. 16 thermal VIAs, evenly spaced on centre paddle connected to ground plane. Pin #1 |
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