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CDP1802BCEX Datasheet(PDF) 27 Page - Intersil Corporation

Part # CDP1802BCEX
Description  CMOS 8-Bit Microprocessors
PDF  27 Pages
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Manufacturer  INTERSIL [Intersil Corporation]
Direct Link  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

CDP1802BCEX Datasheet(HTML) 27 Page - Intersil Corporation

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All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Operating and Handling Considerations
Handling
All inputs and outputs of Intersil CMOS devices have a net-
work for electrostatic protection during handling.
Operating
Operating Voltage - During operation near the maximum
supply voltage limit care should be taken to avoid or suppress
power supply turn-on and turn-off transients, power supply rip-
ple, or ground noise; any of these conditions must not cause
VDD - VSS to exceed the absolute maximum rating.
Input Signals - To prevent damage to the input protection
circuit, input signals should never be greater than VDD nor
less than VSS. Input currents must not exceed 10mA even
when the power supply is off.
Unused Inputs - A connection must be provided at every
input terminal. All unused input terminals must be connected
to either VDD or VSS, whichever is appropriate.
Output Short Circuits - Shorting of outputs to VDD or VSS
may damage CMOS devices by exceeding the maximum
device dissipation.
S1
F
8
LDl
MRP
→ D; RP + 1 → RP
MRP
RP
0
1
0
Fig. 8
9
ORl
MRP OR D
→ D; RP + 1 → RP
A
ANl
MRP AND D
→ D; RP + 1 → RP
B
XRl
MRP XOR D
→ D; RP + 1 →
RP
C
ADl
MRP + D
→ DF, D; RP + 1 →
RP
D
SDl
MRP - D
→ DF, D; RP + 1 →
RP
F
SMl
D - MRP
→ DF, D; RP +1 →
RP
E
SHL
MSB(D)
→ DF; 0 → LSB(D)
Float
RP
1
1
0
Fig. 6
S2
DMA IN
BUS
→ MR0; R0 + 1 → R0
Data from
I/O Device
R0
1
0
0
6, Fig. 12
DMAOUT
MR0
→ BUS; R0 + 1 → R0
MR0
R0
0
1
0
6, Fig. 13
S3
INTERRUPT
X, P
→ T; 0 → lE, 1 → P;
2
→ X
Float
RN
1
1
0
Fig. 14
S1
LOAD
IDLE (CLEAR, WAlT = 0)
M(R0 - 1)
R0 - 1
0
1
0
5, Fig. 8
NOTES:
1. lE = 1, TPA, TPB suppressed, state = S1.
2. BUS = 0 for entire cycle.
3. Next state always S1.
4. Wait for DMA or INTERRUPT.
5. Suppress TPA, wait for DMA.
6. IN REQUEST has priority over OUT REQUEST.
7. See Timing Waveforms, Figure 5 through Figure 14 for machine cycles.
TABLE 2. CONDITIONS ON DATA BUS AND MEMORY ADDRESS LINES DURING ALL MACHINE STATES (Continued)
STATE
I
N
SYMBOL
OPERATION
DATA
BUS
MEMORY
ADDRESS
MRD
MWR
N
LINES
NOTES
CDP1802A, CDP1802AC, CDP1802BC



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