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11. RECOMMENDED MOUNTING CONDITIONS

When mounting this product, please make sure that the following recommended conditions are satisfied.

For packaging methods and conditions other than those recommended below, please contact NEC sales

personnel.

Mounting Condition

Mounting Method

Condition

Soldering

Heating tool 300 to 350°C, heating for 2 to 3 sec; pressure 100 g (per solder)

Thermocompression

ACF

(Adhesive

Conductive Film)

Temporary bonding 70 to 100°C; pressure 3 to 8 kg/cm

Real bonding 165 to 180°C; pressure 25 to 45 kg/cm

(When using the anisotropy conductive film SUMIZAC1003 of Sumitomo

Bakelite, Ltd)

Caution To find out the detailed conditions for packaging the ACF part, please contact the ACF

manufacturing company. Be sure to avoid using two or more packaging methods at a time.

Reference

NEC Semiconductor Device Reliability/Quality Control System (C10983E)

Quality Grades to NEC’s Semiconductor Devices (C11531E)