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AN4165 Datasheet(PDF) 27 Page - STMicroelectronics |
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AN4165 Datasheet(HTML) 27 Page - STMicroelectronics |
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27 / 37 page ![]() AN4165 Thermal measurements Doc ID 023661 Rev 1 27/37 12 Thermal measurements A thermal analysis of the board at full load condition,@ TAMB = 25 ° C has been performed using an IR camera. The worst case is VIN = 85 VAC, but the nominal input voltage cases (VIN = 115 VAC and VIN = 230 VAC) have also been considered. The results are shown in Figure 35, 36, 37 and 38 and summarized in Table 12. Figure 35. Thermal map at TAMB = 25 ° C, VIN =85 VAC, full load Figure 36. Thermal map at TAMB = 25 ° C, VIN = 115 VAC, full load AM13382v1 AM13383v1 Figure 37. Thermal map at TAMB = 25 ° C, VIN = 230 VAC, full load Figure 38. Thermal map at TAMB = 25 ° C, VIN = 265 VAC, full load AM13384v1 AM13385v1 Table 12. Temperature of key components at VIN = 85 VAC /230 VAC, full load (TAMB = 25 ° C) Point T [ ° C] Reference VIN = 85 VAC VIN = 265 VAC A 82.4 76.6 VIPER26 B 68.3 73.3 Transformer C 69.1 67.0 Output diode D 55.4 53.0 Clamping diode E 24.8 24.9 Room temperature |
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