7

LT3463/LT3463A

3463f

PACKAGE DESCRIPTIO

DD Package

10-Lead Plastic DFN (3mm

× 3mm)

(Reference LTC DWG # 05-08-1699)

3.00

±0.10

(4 SIDES)

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).

CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

0.38

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65

± 0.10

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

2.38

±0.10

(2 SIDES)

1

5

10

6

PIN 1

TOP MARK

(SEE NOTE 6)

0.200 REF

0.00 – 0.05

(DD10) DFN 1103

0.25

± 0.05

2.38

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65

±0.05

(2 SIDES)

2.15

±0.05

0.50

BSC

0.675

±0.05

3.50

±0.05

PACKAGE

OUTLINE

0.25

± 0.05

0.50 BSC

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

TYPICAL APPLICATIO

20V

9mA

–20V

9mA

SW1

FB2

LT3463

8

11

L1

10

µH

SHDN2

C2

0.47

µF

2.7V

TO 5V

3463 TA02

GND

4

SW2

5

32

1

D2

C4

0.1

µF

D1

C1

1

µF

FB1

9

6

7

10

SHDN1

R2

1M

R4

1M

R3

61.9k

R1

66.5k

C3

0.47

µF

L2

10

µH

Dual Output

±20V Converter

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.