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TN1037 Datasheet(PDF) 14 Page - STMicroelectronics

Part # TN1037
Description  nano mounting instructions and heatsink
PDF  24 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

TN1037 Datasheet(HTML) 14 Page - STMicroelectronics

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General handling precautions and storage notices
TN1037
14/24
DocID024655 Rev 3
3
General handling precautions and storage notices
When using semiconductors, the incidence of thermal and/or mechanical stress to the
devices due to improper handling may result in significant deterioration of their electrical
characteristics and/or reliability.
3.1
Transportation
Take care when handling the device and packaging material. Ensure that the device is not
subjected to mechanical vibration or shock during transport. Do not toss or drop to ensure
the device is correctly functioning before mounting on the board. Wet conditions are
dangerous. Moisture can also adversely affect the packaging. Place the devices in
conductive trays before using them. Hold the package and avoid touching the leads when
handling devices. Avoid leaning package boxes or applying uneven stress to them as this
could cause the electrode terminals to be deformed or the resin case to be damaged.
Throwing or dropping the packaging boxes might cause the devices to be damaged. Wetting
the packaging boxes might cause the breakdown of devices when in operation.
3.2
Storage
• Do not apply force or excessive external pressure to the devices while they are in storage.
• Do not store the devices in an area exposed to moisture or direct sunlight.
• Humidity should be kept within the range from 40% to 75%, and the temperature not over
35 °C or below 5 °C.
• Do not store in the presence of harmful gases or in dusty environments.
• Lead solderability is degraded by lead oxidation or corrosion. Use of storage areas where
there is minimal temperature fluctuation is highly recommended.
• Use anti-static containers. Unused devices should be stored no longer than one month.
3.3
Environment
• Use a board container or bag that is protected against static discharge when storing
device-mounted circuit boards. Do not stack them directly on top of one another and keep
them separated to prevent the static charge/discharge which occurs due to friction.
• Be sure cardboard surfaces that come into contact with device packaging are made of
materials that will conduct static electricity, and are grounded to the floor surface with a
grounding chain.
• Wear finger cots or gloves protected against static electricity if the body comes into direct
contact with a device.
• When humidity in the working environment decreases, the human body and other
insulators can easily become charged with electrostatic electricity due to friction. Maintain
the recommended humidity within 40% to 60% in the work environment. Be aware of the
risk of moisture absorption by the products after unpacking from moisture-proof
packaging.
• Be sure all equipment and tools in the working area are earth grounded.



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