µPD6124A, 6600A

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25. RECOMMENDED SOLDERING CONDITIONS

It is recommended that

µPD6124A and 6600A be soldered under the following conditions.

For details on the recommended soldering conditions, refer to Information Document “Semiconductor Device

Mounting Technology Manual” (C10535E).

For other soldering methods and conditions, consult NEC.

Table 25-1. Soldering Conditions of Surface-Mount Type

µPD6124AGS-XXX: 20-pin plastic SOP (300 mil)

µPD6600AGS-XXX: 20-pin plastic SOP (300 mil)

Symbol for

Soldering Method

Soldering Conditions

Recommended Condition

Infrared Reflow

Package peak temperature: 230

°C, time: 30 seconds max. (210°C min.), number of times: 1

IR30-00-1

VPS

Package peak temperature: 215

°C, time: 40 seconds max. (200°C min.), number of times: 1

VP15-00-1

Wave Soldering

Soldering bath temperature: 260

°C max., time: 10 seconds max., number of times: 1

Pre-heating temperature: 120

°C max. (package surface temperature)

WS60-00-1

Partial Heating

Pin temperature: 300

°C max., time: 3 seconds max. (per side)

–

Caution

Do not use two or more soldering methods in combination (except the partial heating method).

Table 25-2. Soldering Conditions of Through-Hole Type

µPD6124ACS-XXX: 20-pin plastic shrink DIP (300 mil)

µPD6600ACS-XXX: 20-pin plastic shrink DIP (300 mil)

Soldering Method

Soldering Conditions

Wave Soldering (Only for pin part)

Soldering bath temperature: 260

°C max., time: 10 seconds max.

Partial Heating

Pin temperature: 300

°C max., time: 30 seconds max.

Caution

The wave soldering must be performed at the pin part only. Note that the solder must not be directly

contacted to the package body.