µPD6376

16

8. RECOMMENDED SOLDERING CONDITIONS

The following conditions must be met when performing soldering for the

µPD6376.

For more detailed information, refer to the information document Semiconductor Device Mounting Technology

Manual (C10535E).

For soldering methods and conditions other than the recommended conditions, please consult with an NEC sales

representative.

Surface Mount Type Soldering Conditions

µPD6376GS: 16-pin Plastic SOP (300 mil)

Soldering Process

Soldering Conditions

Symbol

Infrared reflow

Peak package temperature: 230

°C, Time: 30 seconds max. (at 210°C or higher),

IR30-00-1

Count: Once

VPS

Peak package temperature: 215

°C, Time: 40 seconds max. (at 200°C or higher),

VP-15-00-1

Count: Once

Pin Partial heating

Pin temperature: 300

°C or less, Time: 3 seconds max. (per pin row)

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Caution Do not use different soldering methods together (except for pin partial heating).