UPD70320 datasheet(71/74 Pages) NEC

71 / 74 page

µPD70320

RECOMMENDED SOLDERING CONDITIONS

The following conditions must be met when soldering this product.

For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”

(C10535E).

Please consult with our sales office when using other soldering process or under different soldering conditions.

Table 6-1. Surface Mount Type Soldering Conditions

(1)

µPD70320L : 84-pin plastic QFJ (1150 × 1150 mils)

µPD70320L-8 : 84-pin plastic QFJ (1150 × 1150 mils)

Soldering Process

Soldering Conditions

Symbol

VPS

Package peak temperature: 215

°C, Reflow time: 40 seconds or less,

VP15-162-1

Number of reflow processes: 1

Exposure limit: 2 daysNote (16 hours pre-baking is required at 125

°C afterwards)

Partial heating

Pin temperature: 300

°C or below,

—

method

Flow time: 3 seconds or less (per side of device)

Note Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25

°C and relative

humidity at 65% or less.

(2)

µPD70320GJ-5BG

: 94-pin plastic QFP (20

× 20 mm)

µPD70320GJ-8-5BG : 94-pin plastic QFP (20 × 20 mm)

Soldering Process

Soldering Conditions

Symbol

Infrared ray reflow

Package peak temperature: 235

°C, Reflow time: 30 seconds or less,

IR35-367-3

Number of reflow processes: 3 or less

Exposure limit: 7 daysNote (36 hours pre-baking is required at 125

°C afterwards)

VPS

Package peak temperature: 215

°C, Reflow time: 40 seconds or less,

VP15-367-3

Number of reflow processes: 3 or less

Exposure limit: 7 daysNote (36 hours pre-baking is required at 125

°C afterwards)

Wave soldering

Package peak temperature: 260

°C, Reflow time: 10 seconds or less,

WS60-367-1

Number of reflow processes: 1

Pre-heating temperature: 120

°C max. (package surface temperature)

Exposure limit: 7 daysNote (36 hours pre-baking is required at 125

°C afterwards)

Partial heating

Pin temperature: 300

°C or below,

—

method

Flow time: 3 seconds or less (per side of device)

Note Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25

°C and relative

humidity at 65% or less.

Caution

Use of more than one soldering process should be avoided (except for partial heating method).

UPD70320 Datasheet(PDF) 71 Page - NEC

UPD70320 Datasheet(HTML) 71 Page - NEC

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