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UPD77112 Datasheet(PDF) 76 Page - NEC |
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UPD77112 Datasheet(HTML) 76 Page - NEC |
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76 / 80 page  Data Sheet U12801EJ4V0DS00 76 µµµµPD77110, 77111, 77112 µµµµPD77111F1-xxx-CN1: 80-pin plastic fine-pitch BGA (9 ×××× 9 mm) Process Conditions Symbol Infrared ray reflow Package peak temperature: 230 °C, Time: 30 seconds MAX (210°C MIN), Number of times: 2 MAX, Number of days: 3 Note (after that, prebaking is necessary for 10 hours) IR30-103-2 VPS Package peak temperature: 215 °C, Time: 30 seconds MAX (210°C MIN), Number of times: 2 MAX, Number of days: 3 Note (after that, prebaking is necessary for 10 hours) VP15-103-2 Note Number of days in storage after the dry pack has been opened. The storage conditions are at 25 °C, 65% RH MAX. Caution Do not use two or more soldering methods in combination (except partial heating method). |
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