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RFPA2226

DS121010

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.

Evaluation Board Layout and Bill of Materials

(2.5GHz to 2.7GHz)

Board Material GETEK, 10mil thick, Dk=3.9, 2oz. copper

PCB Notes: Do not use less than the recommended number of via holes under the device ground paddle. RF layers thicker

than .020 inches (0.5mm) not recommended..

Bill of Materials

(2.5GHz to 2.7GHz)

DESG

Description

Notes

Q1

RFPA2226

DFN

R1

1.02K,

, 0603 1%

0402 may be used

R2

0

, 0603

0402 may be used

R3

4.02K,

, 0603 1%

0402 may be used

R4

47K,

, 0603

0402 may be used

C1

1uF 16V MLCC CAP

Tantalum ok for EVM performance. Use MLCC type for best IM3 levels.

C2

5.6pF CAP, 0603

NPO ROHM MCH185A5R6DK or equiv.

C3, 4

0.1uF CAP, 0603

X7R 0402 ok, ROHM MCH182CN104K or equiv.

C5

1.6pF CAP, 0603

NPO, low ESR ATC 600S1R6JW250 or equiv.

C6

1.2pF CAP, 0603

NPO, low ESR ATC 600S1R2CW250 or equiv.

C7

1.0pF CAP, 0603

ROHM MCH185A1R0DK or equiv. NPO 0402 ok.

C8

10pF CAP, 0603

NPO, low EST ATC 600S100JW250 or equiv.

L1

12nH IND, 0805

Coilcraft 0805HQ-12NXJBB.