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RT8477A Datasheet(PDF) 11 Page - Richtek Technology Corporation

Part # RT8477A
Description  High Voltage High Multiple-Topology Current LED Driver
PDF  13 Pages
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Manufacturer  RICHTEK [Richtek Technology Corporation]
Direct Link  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

RT8477A Datasheet(HTML) 11 Page - Richtek Technology Corporation

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RT8477A
11
DS8477A-02 April 2015
www.richtek.com
©
Copyright
2015 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
OUT
L
OUT
1
VI
ESR +
8f C

   


Schottky Diode Selection
The Schottky diode, with their low forward voltage drop
and fast switching speed, is necessary for RT8477A
applications. In addition, power dissipation, reverse voltage
rating and pulsating peak current are important parameters
of the Schottky diode that must be considered. The diode's
average current rating must exceed the average output
current. The diode conducts current only when the power
switch is turned off (typically less than 50% duty cycle).
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
PD(MAX) = (TJ(MAX)
− TA) / θJA
where TJ(MAX) is the maximum junction temperature, TAis
the ambient temperature, and
θJAis the junction to ambient
thermal resistance.
For recommended operating condition specifications, the
maximum junction temperature is 125
°C. The junction to
ambient thermal resistance,
θJA, is layout dependent. For
SOP-8 (Exposed Pad) package, the thermal resistance,
θJA, is 30.6°C/W on a standard JEDEC 51-7 four-layer
thermal test board. The maximum power dissipation at TA
= 25
°C can be calculated by the following formula :
PD(MAX) = (125
°C − 25°C) / (30.6°C/W) = 3.26W for
SOP-8 (Exposed Pad) package
The maximum power dissipation depends on the operating
ambient temperature for fixed TJ(MAX) and thermal
resistance,
θJA. The derating curve in Figure 1 allows the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.

 


OUT
IN
OUT
OUT
IN
VV
V
L =
20.3 I
f
V
For Boost application :

 


IN
OUT
IN
OUT
OUT
VV
V
L =
20.3 I
f
V
The inductor must also be selected with a saturation
current rating greater than the maximum inductor current
during normal operation. The maximum inductor current
can be calculated by the following equations.
For Buck application :

 


OUT
IN
OUT
PEAK
OUT
IN
VV
V
I= I
+
2L f
V
For Boost application :


 
 

OUT
OUT
IN
OUT
IN
PEAK
IN
OUT
VI
V
V
V
I=
+
V2 L f
V
where
η is the efficiency of the power converter.
Capacitor Selection
The input capacitor reduces current spikes from the input
supply and minimizes noise injection to the converter. For
most RT8477A applications, a 4.7
μF ceramic capacitor is
sufficient. A value higher or lower may be used depending
on the noise level from the input supply and the input
current to the converter. In Buck application, the output
capacitor is typically ceramic and selection is mainly
based on the output voltage ripple requirements. The
output ripple,
ΔVOUT, is determined by the following
equation :
As a design example, to design the peak to peak inductor
ripple to be
±30% of the output current, the following
equations can be used to estimate the size of the needed
inductance :
For Buck application :
For Buck-Boost application :
IN
OUT
OUT
IN
OUT
PEAK
IN
IN
OUT
V
+ V
I
VV
I=
+
V2 L f
V
+ V

 
 

For Buck-Boost application :
IN
OUT
OUT
IN
OUT
VV
L =
20.3 I
f
V
+ V

 





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