RF Micro Devices Inc.

7628 Thorndike Road, Greensboro, NC 27409-9421

DS140210

For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com.

The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of

third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended

application circuitry and specifications at any time without prior notice.

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SDA-5000

Application Schematic

Die Drawing (Dimensions in millimeters)

Notes:

1.

No connection required for unlabeled bond pads

2.

Die thickness is 0.102mm (4mil)

3.

Typical bond pad is 0.100mm square

4.

Backside metallization: gold

5.

Backside metal is ground

6.

Bond pad metallization: gold

7.

Refer to drawing posted at www.rfmd.com for tolerances