MAX1978 datasheet(2/20 Pages) MAXIM

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Integrated Temperature

Controllers for Peltier Modules

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VDD = PVDD1 = PVDD2 = SHDN = 5V, FREQ = GND, CTLI = FB+ = FB- = MAXV = MAXIP = MAXIN = REF, TA = 0°C to +85°C,

unless otherwise noted. Typical values at TA = +25°C.)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

VDD to GND ..............................................................-0.3V to +6V

SHDN, MAXV, MAXIP, MAXIN,

CTLI, OT, UT to GND............................................-0.3V to +6V

FREQ, COMP, OS1, OS2, CS, REF, ITEC, AIN+, AIN-,

AOUT, INT-, INTOUT, BFB+, BFB-, FB+, FB-,

DIFOUT to GND......................................-0.3V to (VDD + 0.3V)

PVDD1, PVDD2 to VDD ...........................................-0.3V to +0.3V

PVDD1, PVDD2 to GND...............................-0.3V to (VDD + 0.3V)

PGND1, PGND2 to GND .......................................-0.3V to +0.3V

COMP, REF, ITEC, OT, UT, INTOUT, DIFOUT,

BFB-, BFB+, AOUT Short to GND .............................Indefinite

Peak LX Current (MAX1978) (Note 1).................................±4.5A

Peak LX Current (MAX1979) (Note 1)....................................+9A

Continuous Power Dissipation (TA = +70°C)

48-Lead Thin QFN-EP

(derate 26.3mW/°C above +70°C) (Note 2) .................2.105W

Operating Temperature Ranges

MAX1978ETM ..................................................-40°C to +85°C

MAX1979ETM ..................................................-40°C to +85°C

Maximum Junction Temperature .....................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Input Supply Range

VDD

3.0

5.5

VDD = 5V, ITEC = 0 to ±3A,

VOUT = VOS1 - VOS2 (MAX1978)

-4.3

+4.3

VDD = 5V, ITEC = 0 to 6A,

VOUT = VOS1 (MAX1979)

4.3

VDD = 3V, ITEC = 0 to ±3A,

VOUT = VOS1 - VOS2 (MAX1978)

-2.3

+2.3

Output Voltage Range

VOUT

VDD = 3V, ITEC = 0 to 6A,

VOUT = VOS1 (MAX1979)

2.3

MAX1978

±3

Maximum TEC Current

ITEC(MAX)

MAX1979

Reference Voltage

VREF

VDD = 3V to 5.5V, IREF = 150µA

1.485

1.500

1.515

Reference Load Regulation

∆VREF

VDD = 3V to 5.5V, IREF = +10µA to -1mA

1.2

VMAXI_ = VREF

135

150

160

VOS1 < VCS

VMAXI_ = VREF/3

VMAXI_ = VREF

135

150

160

Current-Sense Threshold

VOS1 > VCS

VMAXI_ = VREF/3

VDD = 5V, I = 0.5A

0.04

0.07

NFET On-Resistance

RDS(ON-N)

VDD = 3V, I = 0.5A

0.06

0.08

Ω

VDD = 5V, I = 0.5A

0.06

0.10

PFET On-Resistance

RDS(ON-P)

VDD = 3V, I = 0.5A

0.09

0.12

Ω

VLX = VDD = 5V, TA = +25

°C

0.02

NFET Leakage

ILEAK(N)

VLX = VDD = 5V, TA = +85

°C1

µA

Note 1: LX has internal clamp diodes to PGND and PVDD. Applications that forward bias these diodes should not exceed the IC’s

package power dissipation limits.

Note 2: Solder underside metal slug to PC board ground plane.

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