TLV704

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SBVS148D – OCTOBER 2010 – REVISED JANUARY 2015

6 Specifications

6.1 Absolute Maximum Ratings

Over operating junction temperature range, unless otherwise noted

MIN

MAX

UNIT

IN

–0.3

24

V

Current source

OUT

Internally limited

–40

150

°C

Temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

(2)

All voltages are with respect to network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

2.5

24

V

Output current

0

150

mA

Operating junction temperature

–40

125

°C

6.4 Thermal Information

TLV704

DBV

UNIT

5 PINS

Junction-to-ambient thermal resistance

213.1

Junction-to-case (top) thermal resistance

110.9

Junction-to-board thermal resistance

97.4

°C/W

Junction-to-top characterization parameter

22.0

Junction-to-board characterization parameter

78.4

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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