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TLV704 Datasheet(PDF) 10 Page - Texas Instruments

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Part # TLV704
Description  TLV702 300-mA, Low-IQ, Low-Dropout Regulator
PDF  22 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLV704 Datasheet(HTML) 10 Page - Texas Instruments

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Current
Sense
R
1
R
2
V
IN
GND
V
OUT
I
LIM
Bandgap
Reference
V
REF =1.205V
R =840kW
2
TLV704
SBVS148D – OCTOBER 2010 – REVISED JANUARY 2015
www.ti.com
7 Detailed Description
7.1 Overview
The TLV704 series belong to a family of ultralow IQ LDO regulators. IQ remains fairly constant over the complete
output load current and temperature range. The devices are ensured to operate over a temperature range of
–40°C to 125°C.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Regulator Protection
The TLV704 series of LDO regulators use a PMOS-pass transistor that has a built-in back diode that conducts
reverse current when the input voltage drops below the output voltage (for example, during power down). Current
is conducted from the output to the input and is not internally limited. If extended reverse voltage operation is
anticipated, external limiting is appropriate.
The TLV704 features internal current limiting. During normal operation, the TLV704 limits output current to
approximately 250 mA. When current limiting engages, the output voltage scales back linearly until the
overcurrent condition ends. Do not exceed the rated maximum operating junction temperature of 125°C.
Continuously running the device under conditions where the junction temperature exceeds 125°C degrades
device reliability.
The ability to remove heat from the die is different for each package type, presenting different considerations in
the printed circuit board (PCB) layout. The PCB area around the device that is free of other components moves
the heat from the device to the ambient air. Performance data for JEDEC high-K boards are given in the Thermal
Information table. Using heavier copper increases the effectiveness in removing heat from the device. The
addition of plated through-holes to heat-dissipating layers also improves heatsink effectiveness. Power
dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of the
output current and the voltage drop across the output pass element, as shown in Equation 2.
10
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Product Folder Links: TLV704



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