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TLV704 Datasheet(PDF) 14 Page - Texas Instruments

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Part # TLV704
Description  TLV702 300-mA, Low-IQ, Low-Dropout Regulator
PDF  22 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLV704 Datasheet(HTML) 14 Page - Texas Instruments

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Y
Y
Y ´
JT
J
T
JT
D
: T = T +
P
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JB
J
B
JB
D
: T = T +
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TLV704
SBVS148D – OCTOBER 2010 – REVISED JANUARY 2015
www.ti.com
10.3 Power Dissipation and Junction Temperature
To ensure reliable operation, worst-case junction temperature should not exceed 125°C. This restriction limits the
power dissipation the regulator can handle in any given application. To ensure the junction temperature is within
acceptable limits, calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which
must be less than or equal to PD(max).
The maximum power dissipation limit is determined using Equation 1:
(1)
where:
TJmax is the maximum allowable junction temperature.
RθJA is the thermal resistance junction-to-ambient for the package (see the Thermal Information table).
TA is the ambient temperature.
The regulator dissipation is calculated using Equation 2:
(2)
Power dissipation resulting from quiescent current is negligible.
10.4 Estimating Junction Temperature
The JEDEC standard now recommends the use of psi (
Ψ) thermal metrics to estimate the junction temperatures
of the LDO while in-circuit on a typical PCB board application. These metrics are not strictly speaking thermal
resistances, but rather offer practical and relative means of estimating junction temperatures. These psi metrics
are determined to be significantly independent of the copper-spreading area. The key thermal metrics (
ΨJT and
ΨJB) are given in the Thermal Information table and are used in accordance with Equation 3.
where:
•
PD is the power dissipated as explained in Thermal Information
•
TT is the temperature at the center-top of the device package
•
TB is the PCB surface temperature measured 1 mm from the device package and centered on the package
edge.
(3)
10.5 Package Mounting
Solder pad footprint recommendations for the TLV704 are available from the TI's website at www.ti.com through
the TLV704 series product folders. The recommended land pattern for the DBV package is appended to this data
sheet.
14
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Copyright © 2010–2015, Texas Instruments Incorporated
Product Folder Links: TLV704



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