AM5716 datasheet(4/389 Pages) TI

4 / 389 page

AM5716, AM5718

SPRS919I – JUNE 2014 – REVISED OCTOBER 2015

www.ti.com

Table of Contents

Device Overview

......................................... 1

7.10

External Memory Interface (EMIF)

................. 221

1.1

Features

.............................................. 1

7.11

General-Purpose Memory Controller (GPMC)

..... 221

1.2

Applications

........................................... 2

7.12

Timers

.............................................. 245

1.3

Description

............................................ 2

7.13

Inter-Integrated Circuit Interface (I2C)

............. 245

1.4

Functional Block Diagram

........................... 3

7.14

HDQ / 1-Wire Interface (HDQ1W)

................. 248

7.15

Universal Asynchronous Receiver Transmitter

Revision History

......................................... 5

(UART)

............................................. 250

Device Comparison

..................................... 6

7.16

Multichannel Serial Peripheral Interface (MCSPI)

. 252

3.1

Device Comparison Table

............................ 6

7.17

Quad Serial Peripheral Interface (QSPI)

.......... 258

Terminal Configuration and Functions

.............. 8

7.18

Multichannel Audio Serial Port (McASP)

.......... 263

4.1

Terminal Assignment

................................. 8

7.19

Universal Serial Bus (USB)

........................ 280

4.2

Ball Characteristics

................................... 9

7.20

Serial Advanced Technology Attachment (SATA)

. 280

4.3

Multiplexing Characteristics

......................... 80

7.21

Peripheral Component Interconnect Express

4.4

Signal Descriptions

.................................. 97

(PCIe)

.............................................. 280

Specifications

......................................... 139

7.22

Controller Area Network Interface (DCAN)

........ 281

5.1

Absolute Maximum Ratings

........................ 139

7.23

Ethernet Interface (GMAC_SW)

................... 282

5.2

ESD Ratings

....................................... 140

7.24

eMMC/SD/SDIO

................................... 295

5.3

Power on Hour (POH) Limits

...................... 140

7.25

General-Purpose Interface (GPIO)

................ 319

5.4

Recommended Operating Conditions

............. 141

7.26

PRU-ICSS Interfaces

.............................. 320

5.5

Operating Performance Points

..................... 144

7.27

System and Miscellaneous interfaces

............. 346

5.6

Electrical Characteristics

........................... 163

7.28

Test Interfaces

..................................... 346

5.7

Thermal Characteristics

............................ 171

Applications, Implementation, and Layout

...... 351

5.8

Power Supply Sequences

......................... 173

8.1

Power Supply Mapping

............................ 351

Clock Specifications

................................. 178

8.2

DDR3 Board Design and Layout Guidelines

....... 352

6.1

Input Clock Specifications

......................... 179

8.3

High Speed Differential Signal Routing Guidance

. 376

6.2

DPLLs, DLLs Specifications

....................... 187

8.4

Power Distribution Network Implementation

Timing Requirements and Switching

Guidance

........................................... 376

Characteristics

........................................ 192

8.5

Single-Ended Interfaces

........................... 376

7.1

Timing Test Conditions

............................ 192

8.6

Clock Routing Guidelines

.......................... 377

7.2

Interface Clock Specifications

..................... 192

Device and Documentation Support

.............. 380

7.3

Timing Parameters and Information

............... 192

9.1

Device Support

.................................... 380

7.4

Recommended Clock and Control Signal Transition

9.2

Documentation Support

............................ 381

Behavior

............................................ 194

9.3

Community Resources

............................. 382

7.5

Virtual and Manual I/O Timing Modes

............. 194

9.4

Trademarks

........................................ 382

7.6

Video Input Ports (VIP)

............................ 196

9.5

Electrostatic Discharge Caution

................... 383

7.7

Display Subsystem – Video Output Ports

......... 210

9.6

Glossary

............................................ 383

7.8

Display Subsystem – High-Definition Multimedia

Mechanical Packaging and Orderable

Interface (HDMI)

................................... 220

Information

............................................. 384

7.9

Camera Serial Interface 2 CAL bridge (CSI2)

..... 220

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