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MIC284 Datasheet(PDF) 18 Page - Micrel Semiconductor |
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MIC284 Datasheet(HTML) 18 Page - Micrel Semiconductor |
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18 / 20 page ![]() MIC284 Micrel MIC284 18 September 29, 2000 Applications Remote Diode Selection Most small-signal PNP transistors with characteristics similar to the JEDEC 2N3906 will perform well as remote tempera- ture sensors. Table 6 lists several examples of such parts that Micrel has tested for use with the MIC284. Other transistors equivalent to these should also work well. Minimizing Errors Self-Heating One concern when using a part with the temperature accu- racy and resolution of the MIC284 is to avoid errors induced by self-heating (V DD × IDD) + (VOL × IOL). In order to understand what level of error this might represent, and how to reduce that error, the dissipation in the MIC284 must be calculated and its effects reduced to a temperature offset. The worst-case operating condition for the MIC284 is when V DD = 5.5V, MSOP-08 package. T he maximum power dissipated in the part is given in Equation 1 below. In most applications, the /INT output will be low for at most a few milliseconds before the host resets it back to the high state, making its duty cycle low enough that its contribution to self-heating of the MIC284 is negligible. Similarly, the DATA pin will in all likelihood have a duty cycle of substantially below 25% in the low state. These considerations, combined with more typical device and application parameters, give a better system-level view of device self-heating in interrupt-mode usage. This is illustrated by Equation 2. If the part is to be used in comparator mode, calculations similar to those shown in Equation 2 (accounting for the expected value and duty cycle of I OL(/INT) and IOL(/CRIT)) will give a good estimate of the device’s self-heating error. In any application, the best test is to verify performance against calculation in the final application environment. This is especially true when dealing with systems for which some Vendor Part Number Package Fairchild MMBT3906 SOT-23 On Semiconductor MMBT3906L SOT-23 Phillips Semiconductor PMBT3906 SOT-23 Samsung KST3906-TF SOT-23 Table 6. Transistors Suitable for Remote Temperature Sensing Use of the thermal data (e.g., PC board thermal conductivity and ambient temperature) may be poorly defined or unobtainable except by empirical means. Series Resistance The operation of the MIC284 depends upon sensing the ∆V CB-E of a diode-connected PNP transistor (“diode”) at two different current levels. For remote temperature measure- ments, this is done using an external diode connected be- tween T1 and ground. Since this technique relies upon measuring the relatively small voltage difference resulting from two levels of current through the external diode, any resistance in series with the external diode will cause an error in the temperature reading from the MIC284. A good rule of thumb is this: for each ohm in series with the external transistor, there will be a 0.9 °C error in the MIC284’s temperature measurement. It isn’t difficult to keep the series resistance well below an ohm (typically < 0.1 Ω), so this will rarely be an issue. Filter Capacitor Selection It is sometimes desirable to use a filter capacitor between the T1 and GND pins of the MIC284. The use of this capacitor is recommended in environments with a lot of high frequency noise (such as digital switching noise), or if long wires are used to attach to the remote diode. The maximum recom- mended total capacitance from the T1 pin to GND is 2700pF. This typically suggests the use of a 2200pF NP0 or C0G ceramic capacitor with a 10% tolerance. If the remote diode is to be at a distance of more than ≈ 6" — 12" from the MIC284, using twisted pair wiring or shielded microphone cable for the connections to the diode can significantly help reduce noise pickup. If using a long run of shielded cable, remember to subtract the cable’s conductor- to-shield capacitance from the 2700pF maximum total ca- pacitance. P [(I V ) (I V ) (I V ) (I V )] P [(0.75mA 5.5V) + (6mA 0.8V) + (6mA 0.8V) + (6mA 0.8V) P 18.53mW R of MSOP - 08 package is 206 C / W Maximum T relative to T due to self heating is 18.53mW 206 C / W = 3.82 C DDD DD OL(DATA) OL(DATA) OL(/INT) OL(/INT) OL(/CRIT) OL(/CRIT) D D (j-a) JA =×+ × + × + × = × ××× = ° ∆× ° ° θ Equation 1. Worst-case self-heating [(0.35mA I 3.3V) (25% 1.5mA I 0.3V) (1% 1.5mA I 0.3V) + (25% 1.5mA I 0.3V) = 1.38mW T (1.38mW 206 C / W) DD(typ) OL(DATA) OL(/INT) OL(/CRIT) J ×+ × × + × × × × ∆= × ° = ° 0.29 C Equation 2. Real-world self-heating example |
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