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MIC284 Datasheet(PDF) 18 Page - Micrel Semiconductor

Part # MIC284
Description  Two-Zone Thermal Supervisor Advance Information
PDF  20 Pages
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC284 Datasheet(HTML) 18 Page - Micrel Semiconductor

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MIC284
Micrel
MIC284
18
September 29, 2000
Applications
Remote Diode Selection
Most small-signal PNP transistors with characteristics similar
to the JEDEC 2N3906 will perform well as remote tempera-
ture sensors. Table 6 lists several examples of such parts
that Micrel has tested for use with the MIC284.
Other
transistors equivalent to these should also work well.
Minimizing Errors
Self-Heating
One concern when using a part with the temperature accu-
racy and resolution of the MIC284 is to avoid errors induced
by self-heating (V
DD × IDD) + (VOL × IOL).
In order to
understand what level of error this might represent, and how
to reduce that error, the dissipation in the MIC284 must be
calculated and its effects reduced to a temperature offset.
The worst-case operating condition for the MIC284 is when
V
DD = 5.5V, MSOP-08 package.
T he maximum power
dissipated in the part is given in Equation 1 below.
In most applications, the /INT output will be low for at most a
few milliseconds before the host resets it back to the high
state, making its duty cycle low enough that its contribution to
self-heating of the MIC284 is negligible. Similarly, the DATA
pin will in all likelihood have a duty cycle of substantially below
25% in the low state. These considerations, combined with
more typical device and application parameters, give a better
system-level view of device self-heating in interrupt-mode
usage. This is illustrated by Equation 2.
If the part is to be used in comparator mode, calculations
similar to those shown in Equation 2 (accounting for the
expected value and duty cycle of I
OL(/INT) and IOL(/CRIT))
will give a good estimate of the device’s self-heating error.
In any application, the best test is to verify performance
against calculation in the final application environment. This
is especially true when dealing with systems for which some
Vendor
Part Number
Package
Fairchild
MMBT3906
SOT-23
On Semiconductor
MMBT3906L
SOT-23
Phillips Semiconductor
PMBT3906
SOT-23
Samsung
KST3906-TF
SOT-23
Table 6. Transistors Suitable for Remote Temperature Sensing Use
of the thermal data (e.g., PC board thermal conductivity and
ambient temperature) may be poorly defined or unobtainable
except by empirical means.
Series Resistance
The operation of the MIC284 depends upon sensing the
∆V
CB-E of a diode-connected PNP transistor (“diode”) at two
different current levels. For remote temperature measure-
ments, this is done using an external diode connected be-
tween T1 and ground.
Since this technique relies upon measuring the relatively
small voltage difference resulting from two levels of current
through the external diode, any resistance in series with the
external diode will cause an error in the temperature reading
from the MIC284. A good rule of thumb is this: for each ohm
in series with the external transistor, there will be a 0.9
°C error
in the MIC284’s temperature measurement. It isn’t difficult to
keep the series resistance well below an ohm (typically <
0.1
Ω), so this will rarely be an issue.
Filter Capacitor Selection
It is sometimes desirable to use a filter capacitor between the
T1 and GND pins of the MIC284. The use of this capacitor is
recommended in environments with a lot of high frequency
noise (such as digital switching noise), or if long wires are
used to attach to the remote diode. The maximum recom-
mended total capacitance from the T1 pin to GND is 2700pF.
This typically suggests the use of a 2200pF NP0 or C0G
ceramic capacitor with a 10% tolerance.
If the remote diode is to be at a distance of more than
≈ 6" —
12" from the MIC284, using twisted pair wiring or shielded
microphone cable for the connections to the diode can
significantly help reduce noise pickup. If using a long run of
shielded cable, remember to subtract the cable’s conductor-
to-shield capacitance from the 2700pF maximum total ca-
pacitance.
P
[(I
V
) (I
V
) (I
V
) (I
V
)]
P
[(0.75mA
5.5V) + (6mA
0.8V) + (6mA
0.8V) + (6mA
0.8V)
P
18.53mW
R
of MSOP - 08 package is 206 C / W
Maximum T relative to T due to self heating is 18.53mW 206 C / W = 3.82 C
DDD
DD
OL(DATA)
OL(DATA)
OL(/INT)
OL(/INT)
OL(/CRIT)
OL(/CRIT)
D
D
(j-a)
JA
=×+
×
+
×
+
×
=
×
×××
=
°
∆×
°
°
θ
Equation 1. Worst-case self-heating
[(0.35mA I
3.3V) (25% 1.5mA I
0.3V) (1% 1.5mA I
0.3V) + (25% 1.5mA I
0.3V) = 1.38mW
T
(1.38mW
206 C / W)
DD(typ)
OL(DATA)
OL(/INT)
OL(/CRIT)
J
×+
×
×
+
×
×
×
×
∆=
×
°
=
°
0.29 C
Equation 2. Real-world self-heating example



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