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LM3679 Datasheet(PDF) 16 Page - Texas Instruments

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Part # LM3679
Description  3MHz, 350mA Miniature Step-Down DC-DC Converter for Ultra Low Profile Applications (Height < 0.55mm)
PDF  24 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

LM3679 Datasheet(HTML) 16 Page - Texas Instruments

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LM3679
SNVS510A – SEPTEMBER 2007 – REVISED FEBRUARY 2008
www.ti.com
Figure 26. Board Layout Design Rules for the LM3679
Good layout for the LM3679 can be implemented by following a few simple design rules, as illustrated in Figure.
1. Place the LM3679 on 10.82 mil pads. As a thermal relief, connect to each pad with a 7 mil wide,
approximately 7 mil long trace, and then incrementally increase each trace to its optimal width. The important
criterion is symmetry to ensure the solder bumps on the re-flow evenly (DSBGA PACKAGE ASSEMBLY
AND USE).
2. Place the LM3679, inductor and filter capacitors close together and make the traces short. The traces
between these components carry relatively high switching currents and act as antennas. Following this rule
reduces radiated noise. Special care must be given to place the input filter capacitor very close to the VIN
and GND pin.
3. Arrange the components so that the switching current loops curl in the same direction. During the first half of
each cycle, current flows from the input filter capacitor, through the LM3679 and inductor to the output filter
capacitor and back through ground, forming a current loop. In the second half of each cycle, current is pulled
up from ground, through the LM3679 by the inductor, to the output filter capacitor and then back through
ground, forming a second current loop. Routing these loops so the current curls in the same direction
prevents magnetic field reversal between the two half-cycles and reduces radiated noise.
4. Connect the ground pins of the LM3679, and filter capacitors together using generous component-side
copper fill as a pseudo-ground plane. Then connect this to the ground-plane (if one is used) with several
vias. This reduces ground-plane noise by preventing the switching currents from circulating through the
ground plane. It also reduces ground bounce at the LM3679 by giving it a low-impedance ground connection.
5. Use wide traces between the power components and for power connections to the DC-DC converter circuit.
This reduces voltage errors caused by resistive losses across the traces
6. Route noise sensitive traces such as the voltage feedback path away from noisy traces between the power
components. The voltage feedback trace must remain close to the LM3679 circuit and should be routed
directly from FB to VOUT at the output capacitor and should be routed opposite to noise components. This
reduces EMI radiated onto the DC-DC converter’s own voltage feedback trace.
7. Place noise sensitive circuitry, such as radio IF blocks, away from the DC-DC converter, CMOS digital blocks
and other noisy circuitry. Interference with noise-sensitive circuitry in the system can be reduced through
distance.
16
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Product Folder Links: LM3679



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