SM5022 series

NIPPON PRECISION CIRCUITS—3

PAD LAYOUT

(Unit :

µm)

PINOUT

(Top View)

PIN DESCRIPTION and PAD DIMENSIONS

BLOCK DIAGRAM

Chip size: 1.00

× 0.80 mm

Chip thickness: 220 ± 30 µm

Q

VDD

XT

VSS

(0,0)

(1000,800)

INH

XT

1

XT

VSS

Q

VDD

2

3

6

5

4

XT

INH

Number

Name

I/O

Description

P ad dimensions [µm]

XY

1

INH

I

Output state control input. High impedance when LOW . Pull-up resistor built in

8 3 4

2 1 7

2

X T

I

Amplifier input.

Cr ystal oscillator connection pins.

Cr ystal oscillator connected between XT and X T

637

217

3

V S S

–

Ground

165

165

4

Q

O

1 6 2

6 3 7

5

V D D

–

Supply voltage

859

450

6X T

O

Amplifier output.

Cr ystal oscillator connection pins.

Cr ystal oscillator connected between XT and X T

804

604

XT

VSS

VDD

Q

XT

INH

1/2

1/2

1/2

(INH : Low active)