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PFRR Datasheet(PDF) 1 Page - Vishay Siliconix |
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PFRR Datasheet(HTML) 1 Page - Vishay Siliconix |
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1 / 6 page ![]() PFRR www.vishay.com Vishay Revision: 19-Nov-14 1 Document Number: 53046 For technical questions, contact: sferthinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 ESCC ( ) 4001/023 Qualified R Failure Rate High Precision (10 ppm/°C, 0.05 %) Thin Film Chip Resistors Vishay Sfernice Thin Film division holds ESCC QML qualification (ESCC technology flow qualification). These HiRel components are ideal for low noise and precision applications, superior stability, low temperature coefficient of resistance, and low voltage coefficient, Vishay Sfernice’s precision thin film wraparound resistors exceed requirements of MIL-PRF-55342G characteristics Y (± 10 ppm/°C). FEATURES • Load life stability at ± 70 °C for 2000 h: 0.25 % under Pn • Temperature coefficient to: 10 ppm/°C • Very low noise (< -35 dB) and voltage coefficient (< 0.01 ppm/V) • Resistance range: 100 to 3.01 M (depending on size) • Tolerances down to 0.05 % • SnPb terminations over nickel barrier • ESCC 4001 (generic specification) • ESCC 4001/023 (detail specification) • ESCC qualified • R failure rate (0.01 % per 1000 h) • SMD wraparound chip resistor • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 STANDARD ELECTRICAL SPECIFICATIONS MODEL SIZE ESCC VARIANT NUMBER RESISTANCE RANGE RATED POWER AT + 70 °C (Pn) W LIMITING ELEMENT VOLTAGE (UL) V INSULATION VOLTAGE (Ui) V TOLERANCE ± % TEMPERATURE COEFFICIENT ± ppm/°C PFRR 0402 0402 15 100 to 150K 0.05 30 40 0.05, 0.1 10, 25 PFRR 0603 0603 09 100 to 500K 0.1 50 100 0.05, 0.1 10, 25 PFRR 0805 0805 10 100 to 750K 0.125 100 200 0.05, 0.1 10, 25 PFRR 1206 1206 11 100 to 3.5M 0.25 150 300 0.05, 0.1 10, 25 PFRR 2010 2010 12 100 to 6M 0.50 200 300 0.05, 0.1 10, 25 CLIMATIC SPECIFICATIONS Operating temperature range -55 °C; +155 °C Soldering temperature (Tsol) 260 °C, immersion 10 s MECHANICAL SPECIFICATIONS Substrate material Alumina Technology Thin Film Film Nickel Chromium with mineral passivation Protection Epoxy and Silicon Terminations B type: SnPb over nickel barrier for solder reflow QUALIFIED OHMIC RANGE: MAX. VALUE PFRR0402 PFRR0603 PFRR0805 PFRR1206 PFRR2010 100 k 261 k 301 k 1 M 3.01 M |
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