FS7140, FS7145

http://onsemi.com

4

Parameter

Symbol

Conditions/Description

Min

Typ

Max

Units

OVERALL

Supply current, dynamic

not include load current

35

mA

Supply current, static

SHUT1, SHUT2 bit both “1”

400

700

mA

SERIAL COMMUNICATION I/O (SDA, SCL)

High−level input voltage

V

Low−level input voltage

V

Hysteresis voltage

V

Input leakage current

SDA, SCL in read condition

−10

+10

mA

Low−level output sink current (SDA)

SDA in acknowledge condition;

5

14

mA

ADDRESS SELECT INPUT (ADDR0, ADDR1)

High−level input voltage

V

Low−level input voltage

0.8

V

High−level input current (pull−down)

30

mA

Low−level input current

−1

1

mA

REFERENCE FREQUENCY INPUT (REF)

High−level input voltage

V

Low−level input voltage

0.8

V

High−level input current

−1

1

mA

Low−level input current (pull−down)

−30

mA

SYNC CONTROL INPUT (SYNC)

High−level input voltage

V

Low−level input voltage

0.8

V

High−level input current

−1

1

mA

Low−level input current (pull−down)

−30

mA

CRYSTAL OSCILLATOR INPUT (XIN)

Threshold bias voltage

V

High−level input current

40

mA

Low−level input current

−40

mA

Crystal frequency

Fundamental mode

35

MHz

Recommended crystal load

capacitance*

For best matching with internal crystal

oscillator load

16−18

pF

CRYSTAL OSCILLATOR OUTPUT (XOUT)

High−level output source current

−8.5

mA

Low−level output sink current

11

mA

PECL CURRENT PROGRAM I/O (IPRG)

Low−level input current

−10

10

mA

CLOCK OUTPUTS, CMOS MODE (CLKN, CLKP)

High−level output source current

19

mA

with an asterisk (*) represent nominal characterization data and are not production tested to any specific limits. MIN and MAX characteriza-

tion data are ± 3s from typical. Negative currents indicate flows out of the device.