AP7361C datasheet(5/22 Pages) DIODES

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AP7361C

Document number: DS37274 Rev. 2 - 2

5 of 22

www.diodes.com

September 2015

AP7361C

Electrical Characteristics (@TA = +25°C, VIN = VOUT +1V, CIN = 4.7μF, COUT = 4.7μF, VEN = VIN, unless otherwise specified.)

Symbol

Parameter

Test Conditions

Min

Typ

Max

Unit

VREF

FB Reference Voltage, ADJ pin

IOUT = 10mA, TA = +25°C

0.792

0.8

0.808

IADJ

ADJ Pin Leakage Current

–

0.1

0.5

µA

Input Quiescent Current

Enabled, IOUT = 0A

–

µA

ISHDN

Input Shutdown Current

VEN = 0V, IOUT = 0A

-1

0.05

µA

VOUT

Output Voltage Accuracy

IOUT = 100mA,

TA = +25°C

1.0V

≤VOUT<1.5V

VOUT(s)-

0.015

VOUT(s)

VOUT(s)+0

.015

1.5 V

≤VOUT≤3.5V VOUT(s)*0.99

VOUT(s)

VOUT(s)*1

.01

OUT

ΔV



Line Regulation

VIN = VOUT +1V to 5.5V,

IOUT = 100mA

TA = +25°C

–

0.01

0.1

%/V

-40°C

≤TA ≤ +85°C

–

0.2

VOUT / VOUT Load Regulation

IOUT from 1mA to 1A

-1.0

–

1.0

VDROPOUT

Dropout Voltage (Note 7)

IOUT=300mA

1.0V

≤VOUT<1.1V

–

710

750

1.1V

≤VOUT<1.2V

–

600

640

1.2V

≤VOUT<1.3V

–

500

540

1.3V

≤VOUT<1.4V

–

400

440

1.4V

≤VOUT<1.5V

–

300

340

1.5V

≤VOUT<2.6V

–

200

250

2.6V

≤VOUT≤3.5V

–

100

150

IOUT=1A

1.0V

≤VOUT<1.1V

–

840

–

1.1V

≤VOUT<1.2V

–

780

–

1.2V

≤VOUT<1.3V

–

700

–

1.3V

≤VOUT<1.4V

–

650

–

1.4V

≤VOUT<1.5V

–

600

–

1.5V

≤VOUT<2.0V

–

570

–

2.0V

≤VOUT<2.6V

–

440

–

2.6V

≤VOUT≤3.5V

–

360

–

VIL

EN Input Logic Low Voltage

–

0.3

VIH

EN Input Logic High Voltage

–

1.0

–

VIN

RENPD

EN Pull-Down Resistor

–

3.0

–

Ω

IEN

EN Input Leakage Current

VIN = 5.5V, VEN = 0V

-0.1

–

0.1

µA

RPD

Output Discharge Resistor

VOL=1V

–

100

–

Ω

IOUT

Maximum Output Current

VIN = VOUT +1V

1.0

–

ILIMIT

Current Limit

VIN = VOUT +1V(VIN MINI=2.2V)

1.1

1.5

–

ISHORT

Short-Circuit Current

VIN = VOUT +1V, Output Voltage < 15% VOUT

–

400

–

PSRR

Power Supply Rejection Ratio

(Note 8)

f = 1kHz, IOUT = 100mA

–

f = 10kHz, IOUT = 100mA

–

tST

Start-Up Time

VOUT = 3V, COUT = 2.2µF, RL = 30Ω

–

150

–

µs

OUT

ΔT

ΔV



Output Voltage Temperature

Coefficient

IOUT = 100mA, -40°C ≤ TA ≤ +85°C

–

±100

–

ppm/°C

TSHDN

Thermal Shutdown Threshold

–

150

–

°C

THYS

Thermal Shutdown Hysteresis

–

°C

θJA

Thermal Resistance Junction-to-

Ambient

U-DFN3030-8 (Note 9)

–

°C/W

TO252 (Note 9)

–

SOT223 (Note 9)

–

110

–

SOT89-5 (Note 9)

–

150

–

SO-8EP (Note 9)

–

100

–

Notes:

7. Dropout voltage is the voltage difference between the input and the output at which the output voltage drops 2% below its nominal value. This parameter

only applies to output voltages above 1.2V since minimum VIN = 2.2V.

8. For VIN  2.5V and VIN = VOUT +1V. For VIN < 2.5V, the PSRR performance may be reduced.

9. Test condition: U-DFN3030-8, SO-8EP devices are mounted on 2"x2", FR-4 substrate PCB, with minimum recommended pad on top layer and thermal

vias to bottom layer ground plane. TO252 devices are mounted on 2"x2" FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.

For SOT223, the device is mounted on FR-4 substrate PC board, with minimum recommended pad layout. SOT89-5 devices are mounted on 1"x1" FR-4

substrate PC board, with minimum recommended pad layout.

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