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LSF0101, LSF0102, LSF0108

SDLS966G – DECEMBER 2013 – REVISED FEBRUAURY 2016

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Product Folder Links: LSF0101 LSF0102 LSF0108

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Copyright © 2013–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 5

6.1

Absolute Maximum Ratings ...................................... 5

6.2

ESD Ratings ............................................................ 5

6.3

Recommended Operating Conditions ....................... 5

6.4

Thermal Information: LSF0101, LSF0108................. 6

6.5

Thermal Information: LSF0102 ................................. 6

6.6

Electrical Characteristics........................................... 6

6.7

LSF0101/02 AC Performance (Translating Down)

6.8

LSF0108 AC Performance (Translating Down)

6.9

LSF0101/02 AC Performance (Translating Down)

6.10

LSF0108 AC Performance (Translating Down)

6.11

LSF0101/02 AC Performance (Translating Up)

6.12

LSF0108 AC Performance (Translating Up)

6.13

LSF0101/02 AC Performance (Translating Up)

6.14

LSF0108 AC Performance (Translating Up)

6.15

Typical Characteristics ............................................ 8

7

Parameter Measurement Information .................. 9

8

Detailed Description ............................................ 10

8.1

Overview ................................................................. 10

8.2

Functional Block Diagrams ..................................... 10

8.3

Feature Description................................................. 11

8.4

Device Functional Modes........................................ 11

9

Application and Implementation ........................ 12

9.1

Application Information............................................ 12

9.2

Typical Application .................................................. 12

10

Power Supply Recommendations ..................... 19

11

Layout................................................................... 19

11.1

Layout Guidelines ................................................. 19

11.2

Layout Example .................................................... 19

12

Device and Documentation Support ................. 21

12.1

Related Links ........................................................ 21

12.2

Community Resources.......................................... 21

12.3

Trademarks ........................................................... 21

12.4

Electrostatic Discharge Caution ............................ 21

12.5

Glossary ................................................................ 21

13

Mechanical, Packaging, and Orderable

Information ........................................................... 21

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision F (October 2015) to Revision G

Page

•

Added all available package dimensions in Device Information and changed the pin diagram description. ......................... 1

Changes from Revision E (July 2015) to Revision F

Page

•

Changed Features from "Supports High Speed Translation, Greater Than 100 MHz" to "Supports Up to 100 MHz

Up Translation and Greater Than 100 MHz Down Translation at

≤ 30pF Cap Load and Up To 40 MHz Up/Down

Translation at 50 pF Cap Load." ........................................................................................................................................... 1

•

Updated all propagation delay tables changed from generic to specific LSF devices. ......................................................... 7

Changes from Revision D (October 2014) to Revision E

Page

•

Deleted "Less Than 1.5 ns Max Propagation Delay" from Features. .................................................................................... 1

•

Updated ESD Ratings table. .................................................................................................................................................. 5

•

Changes from Revision C (May 2014) to Revision D

Page

•

Changed bidirectional voltage level translation from 1.0 to 0.95 ........................................................................................... 1

•

Changed YZT package to fix view error. ............................................................................................................................... 1

•

Changed YZT package to fix view error. ............................................................................................................................... 3

•

Added pin numbers to Pin Functions table............................................................................................................................. 4