TXB0101

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SCES639C – JANUARY 2007 – REVISED JUNE 2015

6.4 Thermal Information

TXB0101

DBV (SOT-

DCK

DRL (SOT)

YZP

UNIT

23)

(SC70)

(DSBGA)

6 PINS

6 PINS

6 PINS

6 PINS

Junction-to-ambient thermal resistance

192.3

266.9

204.2

105.8

°C/W

164.8

80.4

76.4

1.6

°C/W

Junction-to-board thermal resistance

38.6

99.1

38.7

10.8

°C/W

Junction-to-top characterization parameter

43.7

1.5

3.4

3.1

°C/W

Junction-to-board characterization parameter

38.1

98.3

38.5

10.8

°C/W

N/A

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

(1) (2)

–40°C to 85°C

TEST

PARAMETER

UNIT

CONDITIONS

MIN

TYP

MAX

MIN

TYP

MAX

1.2 V

1.1

V

1.4 V to 3.6 V

1.2 V

0.9

V

1.4 V to 3.6 V

0.4

1.65 V to 5.5 V

V

1.65 V to 5.5 V

0.4

V

OE

1.2 V to 3.6 V

1.65 V to 5.5 V

±1

±2

μA

A port

0 V

0 V to 5.5 V

±1

±2

μA

B port

0 V to 3.6 V

0 V

±1

±2

A or B port

OE = GND

1.2 V to 3.6 V

1.65 V to 5.5 V

±1

±2

μA

1.2 V

1.65 V to 5.5 V

0.06

1.4 V to 3.6 V

1.65 V to 5.5 V

3

μA

3.6 V

0 V

2

0 V

5.5 V

–2

1.2 V

1.65 V to 5.5 V

3.4

1.4 V to 3.6 V

1.65 V to 5.5 V

5

μA

3.6 V

0 V

–2

0 V

5.5 V

2

1.2 V

1.65 V to 5.5 V

3.5

μA

1.4 V to 3.6 V

1.65 V to 5.5 V

8

1.2 V

1.65 V to 5.5 V

0.05

μA

1.4 V to 3.6 V

1.65 V to 5.5 V

3

OE = GND

1.2 V

1.65 V to 5.5 V

3.3

μA

1.4 V to 3.6 V

1.65 V to 5.5 V

5

OE = GND

OE

1.2 V to 3.6 V

1.65 V to 5.5 V

2.5

3

pF

A port

5

6

1.2 V to 3.6 V

1.65 V to 5.5 V

pF

B port

11

13

(1)

(2)

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