RF430CL330HCPWR datasheet(9/47 Pages) TI1

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SDA

SCL

1/fSCL

tHD,DAT

tSU,DAT

tHD,STA

tSU,STA

tHD,STA

tSU,STO

tSP

RF430CL330H

www.ti.com

SLAS916C – NOVEMBER 2012 – REVISED NOVEMBER 2014

4.9

Serial Communication Protocol Timings

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

MIN

TYP

MAX

UNIT

tSPIvsI2C

Time after power-up or reset until SCMS/CS is sampled for SPI or I2C decision(1)

tReady

Time after power-up or reset until device is ready to communicate using SPI or I2C(2)

(1)

The SCMS/CS pin is sampled after tSPIvsI2C(MIN) at the earliest and after tSPIvsI2C(MAX) at the latest.

(2)

The device is ready to communicate after tReady(MAX) at the latest.

4.10 I

2C Interface

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4-1)

TEST

PARAMETER

VCC

MIN

TYP

MAX

UNIT

CONDITIONS

SCL clock frequency (with Master supporting clock

stretching according to I2C standard, or when the device is

3.3 V

400

kHz

not being addressed)

fSCL

write

3.3 V

120

kHz

SCL clock frequency (device being addressed by Master

not supporting clock stretching)

read

3.3 V

100

kHz

fSCL ≤ 100 kHz

tHD,STA

Hold time (repeated) START

3.3 V

µs

fSCL > 100 kHz

0.6

fSCL ≤ 100 kHz

4.7

tSU,STA

Setup time for a repeated START

3.3 V

µs

fSCL > 100 kHz

0.6

tHD,DAT

Data hold time

3.3 V

tSU,DAT

Data setup time

3.3 V

250

tSU,STO

Setup time for STOP

3.3 V

µs

tSP

Pulse duration of spikes suppressed by input filter

3.3 V

6.25

Figure 4-1. I2C Mode Timing

Specifications

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